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| LFTVS18-1F3 Low forward voltage TransilTM, transient voltage suppressor Features Low forward voltage: 1.1 V @ 850 mA Peak pulse power (8/20 s): 350 W Very low clamping factor VCL/VBR Unidirectional device Fast response time Very thin package: 0.605 mm RoHS compliant Figure 1. Pin configuration (bump side) Flip chip (4 bumps) Complies with the following standards: IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) A B 1 2 Description The LFTVS18-1F3 is a single line diode designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to ESD and EOS transient overvoltages. Figure 2. Device configuration A1 and A2 B1 and B2 TM: Transil is a trademark of STMicroelectronics March 2008 Rev 1 1/7 www.st.com Characteristics LFTVS18-1F3 1 Characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter Peak pulse power dissipation (10/1000 s pulse) Test condition Value 44 Tj initial = Tamb 350 tp = 10 ms Tj initial = Tamb 7 125 -55 to +150 A C C W Unit PPP Peak pulse power dissipation (8/20 s pulse) Non repetitive surge peak forward current Maximum operating junction temperature Storage temperature range IFSM Tj Tstg Table 2. Symbol VBR IRM VRM VCL Rd IPP T VF Symbol VBR IRM VCL VF T Cline Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage IF I Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Voltage temperature coefficient Forward voltage drop Test conditions IR = 1 mA VRM = 10 V IPP = 1 A (1) Slope = 1/Rd VCL VBR VRM IRM VF V IPP Min. 16 Typ. Max. 18 500 19 1.1 9 Unit V nA V V 10-4 / C IF = 850 mA VR = 0 V, VOSC = 30 mV, F = 1 MHz 130 pF 1. 8 / 20 s pulse waveform 2/7 LFTVS18-1F3 Characteristics Figure 3. Relative variation of peak pulse power versus initial junction temperature Figure 4. Peak pulse power versus exponential pulse duration (typical value) Tj initial = 25 C PPP[Tj initial] / PPP[Tj initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 10000 PPP(W) 1000 100 Tj(C) tp(s) 10 1 10 100 1000 Figure 5. Clamping voltage versus peak pulse current (typical values) Figure 6. Relative variation of leakage current versus junction temperature (typical values) 10.0 IPP(A) 1000 tp = 10/1000 s Tj initial = -30 C Tj initial = 25 C Tj initial = 85 C IR[Tj] / IR[Tj=25C] VR =10V 100 1.0 10 VCL(V) 0.1 15 16 17 18 19 20 21 22 23 24 25 1 25 50 75 Tj(C) 100 125 Figure 7. Forward voltage drop versus peak forward current (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) IFM(A) 1.E+02 Capacitance(pF) 140 120 Tj initial = 25 C 1.E+01 Tj initial = 85 C Tj initial = -30 C 80 40 VFM(V) 1.E+00 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0 0 -2 Voltage(V) -4 -6 -8 -10 3/7 Ordering information scheme Figure 9. Breakdown voltage versus initial Figure 10. Frequency response junction temperature (typical value) 0.00 LFTVS18-1F3 19.0 VBR(V) -15.00 18.0 -30.00 17.0 -45.00 Tj( C) 16.0 -60.00 F/Hz 60 85 110 135 100.0k 1.0M 10.0M 100.0M 1.0G -40 -15 10 35 Figure 11. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 12. ESD response to IEC 61000-4-2 (-8 kV contact discharge) X: 20ns/div Y: 10V/div X: 20ns/div Y: 10V/div 2 Ordering information scheme Figure 13. Ordering information scheme LF Low forward voltage Transient voltage suppressor Breakdown voltage 18 = 18 VMAX Number of lines 1 = single line Package F = Flip chip 3: lead free, pitch = 400 m TVS 18 - 1 F3 4/7 LFTVS18-1F3 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 14. Flip chip dimensions 400 m 40 400 m 40 605 m 55 185 m 10 0.77 mm 30 m 205 m 40 185 m 10 0.77 mm 30 m 255 m 40 Figure 15. Footprint recommendations Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 16. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder stencil opening: 220 m recommended xxz y ww 5/7 Ordering information Figure 17. Flip chip tape and reel specifications Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 LFTVS18-1F3 1.75 0.1 3.5 0.1 0.87 xxz yww xxz yww xxz yww 0.71 0.05 All dimensions in mm 8 0.3 User direction of unreeling 0.87 4 0.1 Note: More information is available in the application notes: AN2348: "400 m flip chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 4 Ordering information Table 3. Ordering information Marking EM Package Flip chip Weight 0.86 mg Base qty 5000 Delivery mode Tape and reel (7") Order code LFTVS18-1F3 5 Revision history Table 4. Date 06-Mar-2008 Document revision history Revision 1 Initial release. Changes 6/7 LFTVS18-1F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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